The group highlights that this is a major milestone in its strategic expansion into the front-end semiconductor market and underscores GVT’s growing expertise in critical semiconductor front-end manufacturing processes, including etch, metrology and deposition.
Mainboard-listed semiconductor equipment maker Grand Venture Technology (SGX:JLB
) (GVT) has secured a through-silicon VIA (TSV) project by a global leader in wafer fabrication equipment and services to manufacture components and modules.
TSV technology is essential in semiconductor manufacturing, enabling the delivery of exceptional levels of performance and efficiency. It allows for high-density stacking and direct vertical connections, making it a foundational technology for next-generation chips that powers functions such as artificial intelligence (AI), internet of things (IoT) and advanced computing.
