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ST Engineering signs MOU with Elevandi to support fintech start-ups in cybersecurity

Jovi Ho
Jovi Ho • 2 min read
ST Engineering signs MOU with Elevandi to support fintech start-ups in cybersecurity
From left: Elevandi chairman Sopnendu Mohanty and executive director Pat Patel; Tan Bin Ru, president, enterprise (digital), ST Engineering; and Cheryl Chan, group chief strategy & sustainability officer and president, new ventures, ST Engineering.
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Mainboard-listed ST Engineering has signed a memorandum of understanding (MOU) with Elevandi to jointly support fintech start-ups, collaborate on cybersecurity training and certification and research sustainability solutions with ST Engineering’s corporate venture unit. 

Elevandi is a non-profit organisation set up by the Monetary Authority of Singapore in 2021. Both parties signed the MOU on Nov 15 at the Singapore FinTech Festival 2023. 

The collaboration will first focus on organisations based in Southeast Asia and Australia. ST Engineering’s president for enterprise (digital) Tan Bin Ru says the collaboration extends the group’s focus in fintech. “[It] provides opportunities to co-develop innovative solutions that harness transformative technologies to combat fraud and fight financial crime.”

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