TSMC’s package announced in April includes US$6.6 billion ($8.8 billion) in grants and as much as US$5 billion in loans to support the construction of three semiconductor factories in Phoenix.
Taiwan Semiconductor Manufacturing Co. (TSMC) and GlobalFoundries have finished negotiating binding agreements for billions of dollars in grants and loans to support US factories, people familiar with the matter said, as Biden administration officials race to get Chips and Science Act money out the door.
It is unclear when the agreements will officially be signed and the incentives unveiled, according to the people, who asked not to be identified because the conversations are private. The award amounts are roughly in line with preliminary agreements announced earlier this year, the people said.
