On Dec 19, 2024, the manufacturer further strengthened its position in the space, securing a significant contract to supply parts and components for next-generation thermal compression bonding (TCB) equipment to a “leading global semiconductor assembly and packaging equipment manufacturer”.
Observers are keenly anticipating the continuation of the semiconductor industry’s upcycle this year, and players like Grand Venture Technology (SGX:JLB
) (GVT) are expected to benefit.
Having originally carved its niche in back-end semiconductor manufacturing, such as wire bonding and chip testing, GVT has since expanded into the front-end domain, offering services like metrology and etching. Today, revenue from its semiconductor segment continues to make up the lion’s share, at 53.2% or $59.5 million of the total $111.9 million for the nine months ended Sept 30, 2024, driven by GVT winning new contracts and growing wallet share.
