Citing a report by Yole Intelligence, DBS notes that demand for high end advanced packaging remains robust and is seen to grow at a compound annual growth rate (CAGR) of 37% to US$28 billion by FY2029, supporting demand for TSVs which are foundational for next-generation chips.
The team of analysts at DBS Group Research have kept their “buy” call target price (TP) of $1.04 on manufacturer Grand Venture Technology (SGX:JLB
) (GVT) after it won a so-called TSV (through-silicon VIA) project from a leading wafer fabrication equipment company.
TSV technology, used in semiconductor manufacturing, allows for high-density stacking and direct vertical connections. It is applied as a foundational technology for next-generation chips that powers functions such as artificial intelligence (AI), internet of things (IoT) and advanced computing.
